Spectra7 Partners With Foxconn to Deliver Next Generation 800Gbps Data Center Interconnects

Foxconn will Offer Active Copper Cables with new GC1122 GaugeChanger^TM Technology

SAN JOSE, Calif.–(BUSINESS WIRE)–(TSX-V:SEV) Spectra7 Microsystems Inc. (“Spectra7” or the “Company”), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, today announced that Foxconn Interconnect Technology, Inc. (Foxconn) a leading supplier of interconnect solutions will support next generation 800Gbps Active Copper Cable (ACC) interconnects using Spectra7’s new GC1122 solution.

“Spectra 7 is a key player in the active copper cable market and Foxconn Interconnect Technology has confidently adopted Spectra7 solutions as a fundamental component of our active cable development,” said Yan Margulis, VP Sales and Marketing at Foxconn. “We are seeing significant interest from our largest customers for 800Gbps ACCs with Spectra7 technology and are pleased to be working with them.”

“We’re extremely proud to be working closely with such a major interconnect supplier to the data center market on 800Gbps ACCs using our GaugeChanger™ technology,” said Spectra7 CEO Raouf Halim. “The joint collaboration with Foxconn Interconnect Technology is a major milestone in the development of our 800Gbps data center technology.”

The GC1122 is the latest addition to the GaugeChanger™ product line and extends the data rate from 56Gbps to 112Gbps per lane. Since the GC1122 is analog and highly linear, dynamics such as line rate adjustment, multi-level signaling, intermittent line silence, transmit pre-emphasis or amplitude adjustment and receiver adaptivity are fully preserved.

GaugeChanger™ is an innovative and disruptive technology that allows copper to extend much longer lengths without the cost and power penalty of optics. It works equally well at 25Gbps NRZ, 50Gbps PAM-4 and 100Gbps PAM-4 enabling new connector standards of 100, 200, 400 and 800Gbps.

ABOUT FOXCONN INTERCONNECT TECHNOLOGY, LIMITED (“FIT”)

Foxconn Interconnect Technology, Limited focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components.

For more information, visit FIT’s website: fit-foxconn.com.

ABOUT SPECTRA7 MICROSYSTEMS INC.

Spectra7 Microsystems Inc. is a high-performance analog semiconductor company delivering unprecedented bandwidth, speed and resolution to enable disruptive industrial design for leading electronics manufacturers in virtual reality, augmented reality, mixed reality, data centers and other connectivity markets. Spectra7 is based in San Jose, California with a design center in Cork, Ireland and technical support location in Dongguan, China. For more information, please visit www.spectra7.com.

Neither the TSX Venture Exchange nor its regulation services provided (as that term is defined in the policies of the TSX Venture Exchange) accepts responsibility for the adequacy or accuracy of this release.

CAUTIONARY NOTES

Certain statements contained in this press release constitute “forward-looking statements”. All statements other than statements of historical fact contained in this press release, including, without limitation, those regarding the Company’s future financial position and results of operations, outlook, strategy, proposed acquisitions, plans, objectives, goals and targets, and any statements preceded by, followed by or that include the words “believe”, “expect”, “aim”, “intend”, “plan”, “continue”, “will”, “may”, “would”, “anticipate”, “estimate”, “forecast”, “predict”, “project”, “seek”, “should” or similar expressions or the negative thereof, are forward-looking statements. These statements are not historical facts but instead represent only the Company’s expectations, estimates and projections regarding future events. These statements are not guarantees of future performance and involve assumptions, risks and uncertainties that are difficult to predict. Therefore, actual results may differ materially from what is expressed, implied or forecasted in such forward-looking statements. Additional factors that could cause actual results, performance or achievements to differ materially include, but are not limited to the risk factors discussed in the Company’s Annual Information Form and annual MD&A for the year ended December 31, 2019. Management provides forward-looking statements because it believes they provide useful information to investors when considering their investment objectives and cautions investors not to place undue reliance on forward-looking information. Consequently, all of the forward-looking statements made in this press release are qualified by these cautionary statements and other cautionary statements or factors contained herein, and there can be no assurance that the actual results or developments will be realized or, even if substantially realized, that they will have the expected consequences to, or effects on, the Company. These forward-looking statements are made as of the date of this press release and the Company assumes no obligation to update or revise them to reflect subsequent information, events or circumstances or otherwise, except as required by law.

Contacts

Spectra7 Microsystems Inc.

James Bergeron

Investor Relations

289-512-0541

ir@spectra7.com

Spectra7 Microsystems Inc.

Dave Mier

Chief Financial Officer

925-858-7011

pr@spectra7.com